The HyperConnect consortium includes 10 independent organizations from 5 different countries (CH, D, PL,UK, N), and is composed by 4 small and medium sized enterprises (SMEs), 2 large enterprises, 4 research institutes, and 1 university.

The relatively large number of SMEs in the consortium reflects the highly ambitious nature of the project with regard to exploitation of the results in the form of e. g. sales of materials. IBM as an end user will ensure that the technical development will be driven by valid requirements and thereby ensure rapid adoption of the technology in the market place.

This ambitious project requires state-of-the-art know-how which is available across the European Union rather than within any single member state. The interdisciplinary consortium assembles all of the key-elements to successfully execute the proposed work. All partners contribute with well-established, well-maintained infrastructures which are managed by world class companies and research institutions.

Partner

IBM RESEARCH GMBH, Switzerland

IBM will act as the Project Coordinator in the project (WP6). As an end-user, IBM will participate in the definition of the specifications and process constraints, as well as the design and manufacturing of product-like demonstrators (WP4). IBM’s main research contribution will be in work package processing (WP2), the detailed understanding of the neck-formation and the robust joint formation process. IBM will also support material, modelling and characterization activities in WP1 and WP3. Among a range of relevant experience IBM has participated in e.g. the PF projects NaPa and Nanopack and the Swiss project CMOSAIC.

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FRAUNHOFER ENAS, Germany

ENAS will work with one team on the topic Characterization (WP3) lead by Dr. Remi Pantou (reliability). ENAS will work on processes (WP2) and demonstrators (WP4) with another team lead by Dr. Maik Wiemer (packaging). Here specific test samples will be developed to investigate bonding and filling of micro and nano particles in detail. Additionally ENAS will lead WP 5 (Dissemination). ENAS has a vast experience within technologies for micro- and nano structuring of substrates and packaging, within chip and wafer bonding, and within characterization of micro/nano-reliability – of relevance to this project.

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LORD GERMANY GMBH, Germany

LORD will work with Intrinsiq and Conpart to develop carrier solutions for nano and micro particles as well formulate the back filling adhesive (WP1). LORD will also benchmark state of the art thermally conductive underfills against the output of this project. Their experience in electronic materials of relevance to this project spans more than 40 years, developing custom solutions to address specific performance requirements.

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INTRINSIQ MATERIALS LIMITED, United Kingdom

Intrinsiq Materials will primarily be involved in and lead WP1. Intrinsiq will develop and supply nanoparticles and their dispersions for both the NEI and PTU joining methods. For the NEI structure, Intrinsiq will specifically investigate the use of copper nanoparticles that have been functionalised to allow low temperature sintering. For the PTU system, a range of nanoparticles will be explored and evaluated. The company has produced over 200 different types of nanoparticles to date assuring the sufficient previous experience for this project.

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AMIC Angewandte Micro-Messtechnik GmbH, Germany

AMIC will focus on reliability and experimental tasks within work packages WP2 Processing and WP3 Characterisation. The main activities will be: Thermomechanical modeling and simulation of demonstrators, subsystems, test vehicles and test designs. In addition characterization techniques for micro and nano scaled materials will be developed. AMIC has a well-established expertise in reliability simulation for microelectronic systems with relevance for this project. Lifetime estimation is usually done in a combination with experimental verification and material parameter extraction.

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CONPART AS, Norway

Conpart will develop and supply metal coated micro particles for the NEI joining methods including necessary surface modifications in WP1 They will also contribute with experimental techniques and know-how related to particle manipulation including transport in evaporating liquids in WP2. They will also support characterisation activities in WP3. The last 8 years, the company has been strongly involved in a variety of R&D projects with relevance to this project including both national and international participants (more than 50% of the turnover is related to R&D activities). As examples Conpart, SINTEF and ICSC studied surface functionalization relevant for self assembly of polymer balls in the EU project PARFUN. Conpart has in addition studied application and reliability of polymer balls in e.g. ESiP and the Norwegian project ReMi.

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STIFTELSEN SINTEF, Norway

SINTEF will act as the Technical Coordinator and chair the Technical Committee. SINTEF’s main research contribution will be in work package processing (WP2) related to tailored deposition and immobilization of micron sized MPS and flip-chip prebonding of MPS. SINTEF will design and manufacture test vehicles, conduct experiments on assembly and evaluate results together with the other partners of these tasks. In addition, SINTEF will assist in the development of neck-based electrical interconnect (NEI) in relation to the FCOB demonstrator in particular. SINTEF will support material, modelling and characterization activities in WP1 and WP3. The department has been an active partner in several European projects on development and reliability of electronic packaging, mainly targeting heterogeneous 3D integration: e.g. ENIAC projects JEMSiP_3D and ESiP and the FP7 projects e-CUBES and e-BRAINS.

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ICSC POLSKA AKADEMIA NAUK, Poland

The ICSC (INSTYTUT KATALIZY I FIZYKOCHEMII POWIERZCHNI IM. JERZEGO HABERA POLSKA AKADEMIA NAUK, Poland) will be the scientific partner responsible for surface functionalisation and controlled deposition of nano- and microparticles as well as for advanced analysis of surface coatings. The staff of the Institute have long experience with international cooperation including >50 EU and EEA projects. In the EU project Parfun Conpart, SINTEF and ICSC studied surface functionalization relevant for self assembly of polymer balls on different substrates.

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CHEMNITZ UNIVERSITY OF TECHNOLOGY, Germany

In the project TUC leads and takes mainly part in WP3. It will be involved in activities related to material characterisation (thermal and thermo-mechanical), finite element modelling for thermal and mechanical simulations, and testing and failure analysis of materials and technologies. TUC currently participates in FP7 projects as e.g. SMARTPOWER (die-attach materials) and e-BRAINS (3D-integration) as well as in industry cooperations where they get experience with relevance for this project, adding to their existing.

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STIFTINGA VESTLANDSFORSKING, Norway

The main task for WNRI is to conduct life cycle assessments (LCA) of the new technology to be developed. WNRI has substantial expertise in the field of LCA from research projects conducted within the last 10-15 years. The institute’s competence in this area has been gained through application in a wide range of industrial sectors. Among the researchers taking part in the proposed action there is also highly relevant expertise from international (USA and China) industrial and academic research.

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