The following events are planned to be organized or attended respectively:

InterPack 2013

Enhanced electrical and thermal interconnects enabled by the self-assembly of nanoparticle necks utilizing capillary bridging; T. Brunschwiler, G. Schlottig, S. Ni, Y. Liu, J. V. Goicochea, J. Zürcher, H. Wolf;

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THERMINIC 2013

Conference/Workshop organized by Prof. B. Wunderle and J. Keller

Further information