2011

T. Brunschwiler, J. Goicochea, K. Matsumoto, H. Wolf, C. Kümin, B. Michel, B. Wunderle, W. Faust, „Formulation of Percolating Thermal Underfill by Sequential Convective Gap Filling“, iMAPS 2011 Device Packaging Conference, Scottsdale, Arizona, March 8-10, 2011, p. 229 – 237.

2012

J. Zürcher, J. Goicochea, K. Matsumoto, B. Michel, T. Brunschwiler, „Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications”, Integrated Power Electronics Systems (CIPS), Proceedings 2012 7th International Conference, Nuremberg, Germany, March 6th to 8th, 2012, p. 1-6.

Javier V. Goicochea, Thomas Brunschwiler, Jonas Zürcher, Heiko Wolf, Keiji Matsumoto and Bruno Michel, „Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging”, ITHERM proceedings, San Diego, California, May 30st to June 1st, 2012.

T. Brunschwiler, G. Schlottig, S. Ni, Y. Liu, J. V. Goicochea, J. Zürcher, and H. Wolf, “Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging”, iMAPS proceedings, 45th International Symposium on Microelectronics, San Diego, CA, Sept. 9-13, 2012.

Y. Liu, G. Schlottig, H. Wolf, G. Sotiriou, T. Brunschwiler, “Directed Self-Assembly of Nanoparticles for Novel Electrical Interconnects”, Proceedings ESTC, Amsterdam, 2012.

T. Brunschwiler, G. Schlottig, S. Ni, Y. Liu, J. V. Goicochea, J. Zürcher, and H. Wolf, “Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging”, Journal of Microelectronics and Electronic Packaging, vol. 9, pp. 149-159, 2012.

Maaike M.V. Taklo, "Challenges Related to Underfill for European Activities on 3D Integration" (invited), SEMATECH Underfill challenges for 3D interconnect, San Jose, November 9, 2012.

2013

T. Brunschwiler, G. Schlottig, S. Ni, Y. Liu, J. V. Goicochea, J. Zürcher, H. Wolf, “Enhanced electrical and thermal interconnects enabled by the self-assembly of nanoparticle necks utilizing capillary bridging”, Interpack proceedings, Burlingame , CA, July 17-19, 2013.

Maaike M.V. Taklo, "Kvalitet på elektronikk - hva går galt?" (invited), Elmåledagene 2013, Lillestrøm, Norway, November 20, 2013.

G. Schlottig, F. Schindler-Saefkow, J. Zürcher, B. Michel, and T. Brunschwiler, “Sequentially Formed Underfills: Thermo-Mechanical Properties of Underfills at Full Filler Percolation,” in Proceedings of the 15th Electronics Packaging Technology Conference (EPTC), Singapore, 2013, pp. 565–569.

2014

T. Brunschwiler, G. Schlottig, S. Ni, Y. Liu, J. V. Goicochea, J. Zürcher, H. Wolf,  "Enhanced electrical and thermal interconnects enabled by the self-assembly of nanoparticle necks utilizing capillary bridging", Journal of Electronic Packaging, 2014

Jonas Zuercher, Brian R. Burg, André R. Studart, Thomas Brunschwiler, "Directed Assembly of Nanoparticles by Evaporative Formation of Capillary Bridges in Periodic Micro-Pillar Arrays", MRS Fall Meeting, 2014

Jonas Zuercher, Brian R. Burg, Kai Grossman, André R. Studart, Thomas Brunschwiler, "Directed Assembly of Nanoparticle Necks in a Percolating Microparticle Framework", MRS Fall Meeting, 2014

Severin Zimmermann, Thomas Brunschwiler, Jonas Zuercher, Brian Burg, Guo Hong, Dimos Poulikakos, Mario Baum, Christian Hoffmann, "Characterization of particle beds in percolating thermal underfills based on centrifugation", 3DIC, 2014

Daniel Nilsen Wright, Astrid-Sofie Borge Vardøy, Maaike M.V. Taklo, Helge Kristiansen, "Metal Coated Polymer Spheres for Compliant Fine PitchBall Grid Arrays", 3DIC, 2014

Thomas Brunschwiler, "Orthogonal Scaling: The future path for denser and yet, more efficient systems", Workshop "System Integration Technologies", 2014

T. Brunschwiler, J. Zürcher, S. Zimmermann, G. Hong, B. Burg, G. Schlottig, "Applied Self-Assembly to Perform Electrical and Thermal Interconnects by Capillary Bridging", 5th annual Workshop on Nanotechnology for Microsystems, Tonsberg, Norway, 2014

Brian R. Burg, Manuel Kolly, Kerry Yu, Jonas Zürcher, Gerd Schlottig, and Thomas Brunschwiler, "Thermal Characterization of Percolating Thermal Underfills: Bulk and Cavity", Therminic, 2014

G. Schlottig, "Thermo-Mechanical Properties of Underfills at Partial and Full Filler Percolation – Sub-Layering the Underfill", EuroSimE, 2014

Vinh Cao Duy, Hoang Vu Nguyen, Helge Kristiansen, Maaike M.V. Taklo, Knut E. Aasmundtveit, Nils Hoivik, "Immobilization of Metal Coated Polymer Spheres on In coated pads", ESTC, 2014

Dziedzic Justyna, Potasiewicz Grzegorz, Szczepanowicz Krzysztof, Kruk, Szyk-Warszyńska Lilianna, Warszyński P., "Formation of capillary-bridges with embedded nanoparticles for thermal joints", XLVI Ogólnopolskie Kolokwium Katalityczne, 2014

Brian R. Burg, Manuel Kolly, Bernd Gotsmann, Siegfried Karg, Kerry Yu, Bruno Michel, and Thomas Brunschwiler, "Thermal Conductivity Enhancement in Percolating Thermal Underfills through Necking", ASME International Mechanical Engineering Congress & Exposition (IMECE), 2014

Thomas Brunschwiler, "Orthogonal Scaling: The future path for denser and yet, more efficient systems", 3D TSV Summit, 2014

Thomas Brunschwiler, Florian Schindler-Saefkow, Rachel Gordin, Marie Haupt and Gerd Schlottig, "Compound Properties Study Of Percolating And Neck-Based Thermal Underfills", ITHERM, 2014

 

2015

C. Hofmann, M. Baum, F. Bodny, M. Wiemer, T. Gessner, T. Brunschwiler, J. Zürcher, B. R. Burg, and S. Zimmermann, "Self-Assembly of micro- and nanoparticles by centrifugal forces and capillary bridging for thermal interconnects", Smart Systems Integration Conference, 2015

Fayҫal R. Hamou, Daniel N. Wright, Astrid-Sofie B. Vardøy, Marie Haupt, Susanne Helland, Helge Kristiansen, Maaike M.V. Taklo, "Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS)", EuroSimE, 2015

Daniel Nilsen Wright, Maaike M. Visser Taklo, Mario Baum, Christian Hoffmann, and Helge Kristiansen, "Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres", IMAPS Nordic, 2015

Thomas Brunschwiler, Dominic Gschwend, Stephan Paredes, Timo Tick, Keiji Matsumoto, Christoph Lehnberger, Jens Pohl, Uwe Zschenderlein and Stefano Oggioni, "Embedded Power Insert Enabling Dual-Side Cooling of Microprocessors", ECTC, 2015

Jonas Zürcher, Kerry Yu, Gerd Schlottig, Mario Baum, Maaike M. Visser Taklo, Bernhard Wunderle, Piotr Warszynski, Thomas Brunschwiler, "Nanoparticle Assembly and Sintering Towards All-Copper Flip Chip Interconnects",  ECTC, 2015