Tomorrows micro-electronic devices will have to show more functionality and performance at smaller form factor, lower cost and lower energy consumption in order to be competitive on this multi-billion dollar market. Advanced system integration is thus inevitable, a trend bound to joining dissimilar materials with new packaging technologies. These processes must enable lower thermal resistances and higher interconnect density and device reliability under thermomechanical loading. Therefore advanced experimental characterization and simulation techniques will accompany the material and technology development, in particular involving physics-of-failure-based lifetime modelling. Finally, the joint performance will be validated on four different demonstrators of industrial significance.

A focused research agenda and a consistent development methodology are mandatory to efficiently prove the feasibility of the novel joints. The main scientific and technological challenges will be tackled in 4 synergistic technical workpackages (WPs). WP1 focuses on the development of materials and surfacefunctionalization means. WP2 will explore the parameters resulting in a robust process. WP3 will assess the thermal performance, the thermo-mechanical stability and reliability of the composite with modelling and characterization means. WP3 will also guide the material and process development with a life-cycle assessment. WP4 will demonstrate the viability of the novel joints by delivering a set of demonstrators with relevant specifications and reliability testing of the demonstrators with the novel joints. The system specifications and technological constraints will be defined in WP4 by the industry partners primarily according to roadmaps for high performance processors but also for e.g. mobile applications. The industry takes the role of the integrator and validator throughout the project phases.